Japan Shin-Etsu Silicone Thermal Conductive Material Thermally Conductive Adhesive Material Condensation Reaction Type (One-component) KE-4961-W, KEN-

Thermally conductive adhesives Condensation reaction type (one-component type)

		KE-3467	KE-4961-W	KE-4962-W	KEN-4988-W
curing type		Condensation (deacetone)	Condensation (Dealcoholization)	Condensation (Dealcoholization)	Condensation (Dealcoholization)
Exterior		White	White	White	White
Viscosity	Pa-s	100	Paste	Paste	Paste
Dry time	min	4	1	1	2
Physical properties after curing
Density (23℃)		2.9	2.34	2.65	1.61
hardness	TypeA	91	80	88	76
stretch length	%	30	60	30	70
tensile strength	MPa	3.6	4.4	4.4	4.0
bond strength Al/Al	MPa	0.5	0.7	0.8	1.0
Thermal conductivity	W/m-k	2.4	1.6	2.4	0.75
Flame retardant : UL94		V-0	V-0	V-0 quite	V-0 equivalent (3mm)