Japan Shin-Etsu Silicone Thermal Conductive Material Thermally Conductive Adhesive Material Additional Reaction Type (One-component) KE-1867, KE-1891
Thermally Conductive Adhesives Additional Reactive Types (One-Component Types)
|
|
|
KE-1867 |
KE-1891 |
|
curing type |
|
additional |
additional |
|
Exterior |
|
grey |
grey |
|
Viscosity |
Pa-s |
60 |
Paste |
|
Standard curing time |
min |
120℃×1 hour |
|
|
Properties after curing |
|||
|
Density (23℃) |
|
2.92 |
3.06 |
|
hardness |
TypeA |
75 |
96 |
|
stretch length |
% |
60 |
10 |
|
tensile strength |
MPa |
2.1 |
4.8 |
|
bond strength Al/Al |
MPa |
1.0 |
0.8 |
|
Thermal conductivity |
W/m-k |
2.2 |
4.0 |
|
Flame retardant : UL94 |
|
V-0 |
V-0 |
Features
The glue before curing has various types of viscosity such as medium viscosity to paste, suitable for bonding heating parts
Adoption example
Fixing of substrate parts, etc.
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