Japan Shin-Etsu Silicone Thermal Conductive Material Curable Thermal Grease Two-component Curing Type SDP Series
Advantages of silicone system thermal conductive resin
Compared to non-silicone systems, there is a reduction in thermal resistance after various reliability tests.
Different products can be selected according to the film thickness
Thermal Resistance Reduction Through Thin Film Adjustment - G-OOO Series
When need to use thick film - choose CLG, SDP series
|
product name |
G-OOO series |
G-OOO series |
SDP series |
|
|
type |
One-component type |
Two-component type |
||
|
feature |
non-curing |
Curing type (condensation, additional) |
non-curing |
Curing type (additional) |
|
Utilize film |
filler |
|||
Curable thermal grease Two-component curing type SDP series
|
|
SDP-1030-A/B |
SDP-2060-A/B |
SDP-3540-A/B |
SDP-5040-A/B |
SDP-6560-A/B |
|
type |
two-component curing (additional) |
two-component curing (additional) |
two-component curing (additional) |
two-component curing (additional) |
two-component curing (additional) |
|
Exterior |
white/aqua |
white/aqua |
White grey |
grey/pink |
grey/pink |
|
Viscosity (Pa-s) |
102 / 55 |
99 / 71 |
103 / 72 |
181 / 162 |
282 / 288 |
|
Mixed Viscosity (Pa-s) |
74 |
81 |
89 |
169 |
284 |
|
Operation time (min) |
240 |
240 |
240 |
240 |
240 |
|
Standard curing time |
25℃×24h |
25℃×24h |
25℃×24h |
25℃×24h |
25℃×24h |
|
Density after curing: 23℃ |
2.45 / 2.45 |
2.87 / 2.87 |
3.08 / 3.07 |
3.25 / 3.26 |
3.20 / 3.20 |
|
Hardness (Asker C) |
10 |
25 |
17 |
16 |
30 |
|
Thermal conductivity (W/m-K) |
1.1 / 1.1 |
2.3 / 2.3 |
3.5 / 3.5 |
5.1 / 5.1 |
6.5 / 6.5 |
|
Elongation(%) |
480 |
70 |
40 |
30 |
20 |
|
Tensile length (MPa) |
0.3 |
0.3 |
0.1 |
0.1 |
0.1 |
Features
・ Thermally conductive material that can be cured at room temperature by two-component mixing.
・ Because of its low hardness, the load on parts can be reduced. And there is no adhesiveness with the substrate, so it can be reworked.
Applications
On-board ECU and various sensors
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