Japan Shin-Etsu Silicone Thermal Conductive Material Non-curing Thermal Grease CLG Series
Advantages of silicone-based thermally conductive resins
Compared to non-silicone systems, there is a reduction in thermal resistance after various reliability tests.
Different products can be selected according to the film thickness
Thermal Resistance Reduction Through Thin Film Adjustment - G-OOO Series
When need to use thick film - choose CLG, SDP series
|
product name |
G-OOO series |
CLG series |
SDP series |
|
|
type |
One-component type |
Two-component type |
||
|
Two-component type |
non-curing |
Curing type (condensation, additional) |
non-curing |
Curing type (additional) |
|
Utilize film |
filler |
|||
Non-curing thermal grease CLG series
|
|
CLG-1500 |
CLG-2500 |
CLG-3500 |
CLG-4500 |
|
type |
one-component gel |
one-component gel |
one-component gel |
one-component gel |
|
Exterior |
White |
White |
White |
White |
|
Density: 25℃ |
2.6 |
2.9 |
3.1 |
3.2 |
|
Viscosity (Pa-s) |
500 |
500 |
250 |
550 |
|
Thermal conductivity (W/m-K) |
1.5 |
2.9 |
3.5 |
4.8 |
|
Breakdown Voltage (kv/mm) |
9.6 |
6.2 |
8.9 |
4.7 |
|
Low molecular ppm |
300 or less |
300or less |
300or less |
300or less |
Improved extrusion resistance (sag resistance) type
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