Japan Shin-Etsu Silicone Thermal Conductive Material Curable Thermal Grease G 1000, G 789, GUV 300

Advantages of silicone system thermal conductive resin

Compared to non-silicone systems, there is a reduction in thermal resistance after various reliability tests.

Different products can be selected according to the film thickness

Thermal Resistance Reduction Through Thin Film Adjustment - G-OOO Series

When need to use thick film - choose CLG, SDP series

product name	G-OOO series		CLG series	SDP series
type	One-component type			Two-component type
feature	non-curing	Curing type (condensation, additional)	non-curing	Curing type (additional)
	Utilize film		filler

Cured thermal grease

		G-1000	G-789	GUV-300
type		single component Hardening (Condensation/Deacetone)	single component hardened (additional)	single component Hardening (UV hardening)
Exterior		White	White	White
Viscosity (Pa-s)	Pa-s	80	130	154
Standard curing conditions		23℃×50%×7days	125℃×90min	6,000mJ(365nm)+25℃×24h
Density after curing: 23℃		3.0	3.1	3
hardness	Asker C	40	10	Modulus 39 kPa.s
Thermal conductivity	W/m-k	2.4	3.0	3.1
BLT	μm	50	25	-
Thermal resistance	mm2-K/W	29	11	-
breakdown voltage	kV/mm	14	14	-