Japan Shin-Etsu Silicone Thermal Conductive Material Non-curing Thermal Grease G 776, G 787, G 790

Advantages of silicone system thermal conductive resin

Compared to non-silicone systems, there is a reduction in thermal resistance after various reliability tests.

Different products can be selected according to the film thickness

Thermal Resistance Reduction Through Thin Film Adjustment - G-OOO Series

When need to use thick film - choose CLG, SDP series

product name	G-OOO series		CLG series	SDPseries
type	One-component type			Two-component type
feature	non-curing	Curing type (condensation, additional)	non-curing	Curing type (additional)
	Utilize film		filler

Non-curing thermal grease Solvent-containing type

	G-776	G-787	G-790
feature	Standard	High thermal conductivity	Low thermal resistance
Exterior	White	White	White
Density: 25℃	2.9	3.48	3.2
Viscosity (Pa-s) before volatilization	60	70	80
Viscosity (Pa-s) after volatilization	500	200	290
Volatile amount (%) 150℃ X 24h	3.1	0.93	1.03
Thermal conductivity (W/m-K) before volatilization	1.0	3.3	2.6
Thermal conductivity (W/m-K) after volatilization 1.3 4.0 3.0	1.3	4.0	3.0
BLT thickness (μm)	8	32	9
Thermal Resistance (mm2-K/W)	7.4	9.5	4.7
Breakdown voltage (kV/0.25mm)	2.5	2.4	2.5
Applicable temperature range (℃)	-40 ~ 200	-40 ~ 200	-40 ~ 200