Others

Kao Cleanthrough A Series Dry Momo Peeling Liquid A-07 A-06 A-11D

Product list

	A-07 A-11D	A-06 （A-06A+B）	Development product A	Development product B
use	low corrosion solder bumps	Precision SAP Thick dry film	TMAH free Precision SAP	Universal SAP
TMAH	contains	contains	not included	not included
organic amine	contains	contains	contains	not included
price	middle	middle	Middle and high	Low

Product Features

A-07/A-11D: Low Corrosion
- Prevent corrosion of metal and other peripheral materials
A06: Quick Peel Film
-High permeability, small film fragmentation, 30% shorter peeling time than commercial products
-Suitable for thick film and precision circuit, film thickness ≥100µmt; spacing L/S < 6/6µm
- High tolerance to CO2 degradation, 200% higher carbonate stability than commercial products
Development product: TMAH free
Development Product A - High Efficiency Type, Applicable to Precision SAP Process
Development B - Generic, such as CSP