Japan Shin-Etsu Silicone Thermal Conductive Material Thermally Conductive Adhesive Material Additional Reaction Type (two-component) KE-1897-AB, KE-18 - 广州昊毅新材料科技股份有限公司

Silicone Thermal Conductive Material

Japan Shin-Etsu Silicone Thermal Conductive Material Thermally Conductive Adhesive Material Additional Reaction Type (two-component) KE-1897-AB, KE-18

  Thermally Conductive Adhesives Additional Reaction Types (two-component)  

 

 

KE-1184-AB

KE-1185-AB

KE-1285-AB

KE-1292-AB

X-4032-3705-AB

curing type

 

two-component add-on

two-component add-on

two-component add-on

two-component add-on

two-component add-on

Exterior

 

off-white/off-white

off-white/grey

grey/off-white

black, grey

grey White

Viscosity

Pa-s

50/40

59 / 66

25 / 5

5 / 2

2.4 / 2.6

mixed viscosity

Pa-s

45

61

9

3

2.5

Standard curing conditions

 

40℃*15min

23℃*60min

90℃*10min or

23℃*24 hours

120℃×60min

80℃×120min

120℃×60min

Physical properties after curing

Density (23℃)

 

2.78

2.78

1.72

1.48

1.73

hardness

TypeA

48

59

56

37

50

stretch rate

%

60

70

140

140

15

tensile strength

MPa

0.9

1.3

2.8

1.8

0.4

bond strength

Al/Al

MPa

0.6

0.7

1.5

0.6

0.4

Thermal conductivity

W/m-k

2.0

1.8

0.8

0.55

1.2

Flame retardant : UL94

 

HB equivalent

HB equivalent

V-0

V-0

V-0

 

 

 

KE-1897-AB

KE-1898-AB

KE-1899-AB

curing type

 

two-component add-on

two-component add-on

two-component add-on

Exterior

 

grey White

grey White

grey White

Viscosity

Pa-s

11/7

22/14

24/15

mixed viscosity

Pa-s

9

15

19

Standard curing grid

 

120℃×60min

120℃×60min

120℃×60min

Properties after curing

Density (23℃)

 

2.61

2.86

3.00

hardness

TypeA

20

22

12

stretch length

%

100

60

60

tensile strength

MPa

0.4

0.4

0.2

bond strength

Al/Al

MPa

0.3

0.3

0.2

Thermal conductivity

W/m-k

1.6

2.2

3.0

Flame retardant : UL94

 

V-0

V-0

V-0 quite

 

 Features

・ Because of its fluidity, it is suitable for potting of heat-generating parts (transformers and coils) in the module

・ Low hardness after curing, reducing the load on the coated parts

Adoption example

energy modules, etc.
 

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