Japan Shin-Etsu Silicone Thermal Conductive Material
The distinction and type of thermal conductive silicone
| Distinguish | Type | Performance |
| Thermally conductive adhesive | ① Hardening type (condensation reaction/additional reaction) Self-adhesive Thermal Grease |
self-adhesive |
| Thermal Grease |
① Hardened type ②Non-curing type |
① Hardened type ②Non-curing reworkability (no adhesion) Reworkability (no adhesion) |
|
导热有机硅 |
distinguish |
type |
|
product name |
|
Thermally conductive adhesive |
hardened |
One-component condensation (room temperature curing) |
KE-4961-W、KEN-4988-W（南通品） |
|
|
KE-4962-W、KE-3467 |
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|
One-component add-on (heat curing) |
KE-1867、KE-1891 |
|||
|
Two-component add-on (heat curing) |
KE-1285-AB、KE-1292-AB、X-32-3705-AB（南通品） |
|||
|
KE-1897-AB、KE-1898-AB、KE-1899-AB |
||||
|
Two-component add-on (low temperature curing) |
KE-1184-AB、KE-1185-AB |
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|
Thermal Grease |
non-hardening |
Solvent-free (thin coating) |
G-775、G-777、G-779 |
|
|
Solvent-based (thin coating) |
G-776、G-790、G-787 |
|||
|
Solvent-based (thin and thick film) |
CLG series |
|||
|
hardened |
One-component condensation (room temperature curing) |
G-1000 |
||
|
One-component add-on (heating / UV) |
G-789、GUV-300 |
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|
Two-component add-on (room temperature cure) |
SDP series |
About Condensation and Additional Reactions
Curing Types and Characteristics
