Covestro Desmodur T80 Toluene-2,4-diisocyanate TDI80
Covestro Desmodur T100 Pure TDI TDI 100
BASF Efka® low molecular weight dispersant for non-aqueous systems
Covestro Desmodur N3800 HDI polyisocyanate curing agent increases flexibility
INV High Primary Hydroxylation Modified Polyether Polyol P1000 P2000
SKYBON ES-750 Saturated Polyester Resin
Japan Shin-Etsu Silicone Thermal Conductive Material
Japan Shin-Etsu Silicone RTV
Japan's Shin-Etsu KP series leveling agent defoaming agent lubricity improver mold release imparting agent
Japan Shin-Etsu Coating Film Surface Modifier Silica Fume
Japan Shin-Etsu Polyurethane Resin
Japan Shin-Etsu epoxy resin
Japan Shin-Etsu polyester, alkyd resin
Japan Shin-Etsu Silicone Silicone Resin
Japan Shin-Etsu Silane Coupling Agent
Japan Shin-Etsu Silicone Resin
BASF Dispex® & Efka® high molecular weight dispersants
Germany BASF curing agent BASF Basonat HI 100 solvent-free non-yellowing curing agent